The implementation of ASIC packaging design and manufacturing technologies on high performance networking products | IEEE Conference Publication | IEEE Xplore

The implementation of ASIC packaging design and manufacturing technologies on high performance networking products


Abstract:

This paper briefly presents how silicon integration and advances in packaging technology have enabled higher performance networking products, and is followed by discussio...Show More

Abstract:

This paper briefly presents how silicon integration and advances in packaging technology have enabled higher performance networking products, and is followed by discussions of how a system-level integrated approach is needed to address the challenges of the next generation products. Different methodologies of integrating memory and ASIC using advanced packaging technologies at both package level and board-/system-level are presented. Both connector-based and SMT based system in package (SiP) solutions with either flip-chip bare-die or BGA technologies are evaluated. Impact of each technology on product designs at silicon, substrate, and board level, as well as the effects on product manufacturability and reliability are discussed.
Date of Conference: 31 May 2005 - 03 June 2005
Date Added to IEEE Xplore: 20 June 2005
Print ISBN:0-7803-8907-7

ISSN Information:

Conference Location: Lake Buena Vista, FL, USA

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