Thermal and structural properties of elastic epoxy for high voltage

Elastic factors of elastic epoxy were investigated by TMA (thermomechanical analysis), DMTA (dynamic mechanical thermal analysis), and FESEM (field emission scanning electron microscope) as toughness investigation to improve brittleness of existing epoxy resin. We made of specimens with the contents of 0 phr, 20 phr and 35 phr. The ranges of measurement temperature of the TMA and DMTA were changed from -20 /spl deg/C to 200 /spl deg/C. Glass transition temperature (Tg) of elastic epoxy was measured through thermal analysis equipment. Also, thermal expansion coefficient (/spl alpha/), modulus and loss factor were investigated through TMA, and DMTA. In addition, the structures of specimens were analyzed through FESEM, and then elastic factors of elastic epoxy were visually showed by FESEM. As thermal analysis results, 20 phr was more excellent than 35 phr thermally and mechanically. Specially, thermal expansion coefficient, modulus, and damping properties were excellent. By structure images analysis through FESEM, we found elastic factors of elastic epoxy that is not existing epoxy, and proved high impact.