Thermal conductivity influence on failures of semiconductor ICs under powerful EMP action | IEEE Conference Publication | IEEE Xplore

Thermal conductivity influence on failures of semiconductor ICs under powerful EMP action

Metadata

First Page of the Article

Published in: 2003 IEEE International Symposium on Electromagnetic Compatibility, 2003. EMC '03.

Date of Conference: 11-16 May 2003

Date Added to IEEE Xplore: 16 May 2005

Print ISBN:0-7803-7779-6

DOI: 10.1109/ICSMC2.2003.1429092

Conference Location: Istanbul, Turkey

First Page of the Article

References is not available for this document.