Cutting for QFN packaging by diode pumping solid state laser system

This packaging method QFN could reduce thermal-resistance, less size for packaging and weight, suitable for medium or small pads IC with high speed and high frequency applications for products. By such packaging process, QFN ICs need to separate for mounting on the different applications of printed-circuit boards, cutting the strips by saw machine would be fine now for mass production, but there are something worse, including IC crack easy, stress releasing problem, space wasting...and so on. So this paper focus on the result of laser cutting on QFN IC strips by using diode pumped solid state laser system, and describe the detail effect of laser parameters, it would tell us the technology of laser cutting for QFN with excellent good results, the new development for laser applications should be worth for semiconductor industry