Fitting optical interconnects to an electrical world-packaging and reliability issues of arrayed optoelectronic modules

Utilization of optical links must fit current packaging scenarios in electrical systems. Due to interboard spacing in electrical system racks, optical interconnects must go though a right angle turn to reach the backplane which is commonly the case in the manufacture of VCSEL optoelectronic module. VCSEL reliability is also an issue in hampering its utilization. Increasing data rate in VCSEL entails increasing current density which reduces reliability. The talk offers a detailed discussion on the packaging, and reliability and failure of VCSELs.