Thin film inverted MSM photodetector with top bonding pads for nano paste metallization

This study has demonstrated the assembly of a thin film inverted MSM photodetector (I-MSM) on a Si CMOS TIA in a monolithic dimension. The I-MSM has top bonding pads and is connected with the TIA using nano paste metallization. Operation at 622 M-bit/s with optical input has been successfully demonstrated.