Thermal-mechanical stress analysis in embedded power modules

Embedded power modules are examples of planar integration using metallization interconnections. Mechanical properties of interfaces between deposited copper traces and substrates are important for reliable operation. This paper investigates the values of thermal-mechanical stresses by IDEAS simulation. The effects of the deposited copper shape to the thermal-mechanical stress are illustrated in a simplified structure. Then a multi-layer structure of an embedded power module was modeled and the thermal-mechanical stresses of different layers were analyzed. The temperature cycling and power cycling test results are presented.