Bonding of polymer microstructures by UV irradiation and welding at low temperatures

A new bonding process has been developed for polymer microstructures, especially of Polymethylmethacrylate (PMMA), which avoids the problems caused by using adhesives or solvents or applying high temperatures. It is based on photo degradation of polymers. Moulded PMMA microchannels and microspectrometer gratings were covered with PMMA plates by ultraviolet irradiation of the joining faces and subsequent welding at low temperatures. Because of the low thermal load, structure details even in the submicrometer range remain dimensionally stable during the bonding process.