Design for reliability (DFR) methodology for electronic packaging assemblies

Design for reliability requires knowledge based in materials testing and modeling, finite element modeling and simulation, failure mechanism and life prediction and reliability tests for validation. A comprehensive mechanics characterization of electronic solders such as Sn/Pb and Pb-free solders has been established. Examples of conventional 2D and 3D Finite Element Analysis is provided for Thermal Cycling analysis of elastic-plastic-creep analysis of solder joints. The combined effect of modeling viscoelastic underfill and viscoplastic solder is reported for thermal cycling (TC) and thermal shock loading (TS). Two global-local modeling techniques for board-level analysis was calibrated. The global-local 3D modeling techniques are global-local submodeling (GLS) and global-local-beam (GLB) methods.