Novel LTCC-/BGA-modules for highly integrated millimeter-wave transceivers

This paper demonstrates advanced packaging concepts for highly integrated encapsulated millimeter-wave modules. Millimeter-wave monolithic integrated circuits (MIMIC) are flip-chip mounted on top of a LTCC package (low temperature co-fired ceramic). This type of "smart package" can integrate all kinds of passive functions as well as compact interconnections between MIMIC and vertical feedthroughs. The bottom side of this package is connected via a standard ball grid array (BGA) to a low-cost laminate PCB serving as motherboard for multiple LTCC modules. Fabricated LTCC test structures and LTCC test packages provide good performance up to about 30 GHz.