A 100-GHz distributed amplifier in chip-size package

We developed a new millimeter-wave plastic chip size package (CSP) to operate up to 100 GHz by using a thin-film substrate. It has a flip-chip distributed amplifier with inverted microstrip lines that has a bandwidth of beyond 110 GHz. The CSP amplifier achieved a gain of 7.8 dB and a 3 dB bandwidth of 97 GHz, and operated up to 100 GHz as an amplifier. To our knowledge, this value is the highest operating frequency reported to date for a distributed amplifier sealed in a plastic CSP.