Overlap optimization in semiconductor waveguides by wafer bonding

In this work, we show that the use of a wafer-bonding technique, wherein an inverted half-waveguide structure is bonded on the upright half to form a complete waveguide, optimizes the overlap factor present in three-wave parametric interactions realized in 43m semiconductor waveguides. These optimized waveguides can be used for efficient frequency-mixing devices which detect or emit infrared light.