Analysis and characterization of device variations in an LSI chip using an integrated device matrix array

For future LSI design technology, the device matrix array (DMA), which can precisely evaluate variation in device parameters within a die, has been developed. The DMA consists of a 14-by-14 array of common units. The unit size is 240 by 240 /spl mu/m, and each unit contains 148 measurement elements (52 transistors, 30 capacitors, 51 resistors, and 15 ring oscillators).