An integrated test chip for the complete characterization and monitoring of a 0.25/spl mu/m CMOS technology that fits into five scribe line structures 150/spl mu/m by 5000/spl mu/m

A novel on-chip switch-matrix design, with integrated CBCM structures, enabled an entire test chip containing 340 test devices to be integrated into 5 scribe line test structures. Using full Kelvin sensing, the resulting structures provided improved accuracy over conventional test structure design. Each row has only 14 probe pads and contains either 75 MOS or 50 CV DUTs. This test chip was used to completely characterize a 0.25/spl mu/m Mixed Signal CMOS process and then extended for 0.13/spl mu/m CMOS technologies.