A practical methodology for multi-modality electromigration lifetime prediction

Multiple electromigration failure mechanism was observed in advanced dual damascene Cu interconnects. The complex failure behaviors make precision lifetime prediction more challenging. In the present work, multi-modality electromigration behavior of Cu dual damascene interconnects were studied. Both superposition and weak link models were used for statistical determination of lifetimes of each failure model (statistical method). Results were correlated to the lifetimes of respective failure models physically identified according to resistance time evolution behaviors (Physical method). Good agreement was achieved.