Broadband capacitive micromachined ultrasonic transducers ranging from 10 kHz to 60 MHz for imaging arrays and more

Capacitive micromachined ultrasonic transducers (CMUTs) have long been studied. Past research has shown that CMUTs indeed have remarkable features such as wide bandwidth and high efficiency. This paper introduces an inclusion to the CMUT technology that uses the wafer-bonding technique to fabricate membranes on silicon. This new technology enables the fabrication of large membranes with large gaps, and expands the frequency span of CMUTs to 10 kHz in the low end. CMUT devices with different frequency spans are fabricated using both technologies, and tested. Electromechanical coupling efficiency, k/sub T//sup 2/, value as high as 0.85 and fractional immersion bandwidth as wide as 175 % are measured.