An Alternate Method of Fabricating Multilayer-Multichip Ceramic Substrates

In the IBM Corporation, packaging designs have evolved from single-sided circuitry on pinned ceramics to complex, multilayer structures with internally interconnected wiring produced with "punch and fill" via technology. The transverse via, a unique method of forming multilevel-multichip substrates without employing the via punching and filling process to form the interplane and input/output (I/O) communication paths, is described.