Large Scale Digital Hybrid Microcircuits for New Military Systems

The packaging density of digital circuits can be significantly increased by assembling multiple MSI, LSI, and VLSI semiconductor chips in large hybrid microcircuits. The design, manufacturing, and productbility factors for these large multilayered thick film hybrid microcircuits are described. These factors include: manual and computer aided design, materials, substrate processing, assembly, testing, and environmental screening. Recent production experiences in manufacturing three unique microcircuits containing TTL, C-MOS, and ECL devices are discussed.