Addressing Energy and PFAS Chemical Consumption in Semiconductor Manufacturing: Case Study in a University Fab

This study involves the tabulation of energy usage for a standard metal-oxide semiconductor field-effect transistor (MOSFET) manufacturing process in a university semiconductor fabrication teaching laboratory. The purpose of the energy audit is to pave the way for further reductions in energy usage and more efficient fabrication processes, to lessen the semiconductor industry’s burden on the global energy supply chain. A prototype photovoltaic system is designed to offset the energy usage of this process providing a vision towards the use of renewables. For the chemical case study, a comparison of reactive ion etching to ion beam etching is done to observe differences in the efficiency and results of the processes and to compare their prospects for widespread use within industry. Reactive ion etching involves the use of harmful per- and polyfluoroalkyl (PFAS) substances. Ion beam etching is another etching technology that is less widespread in large-scale manufacturing but consumes inert gases and does not produce environmental toxins as a byproduct. The study of these two important areas, at an educational level, will be a way for the future of the industry to improve the impact they have on society by re-engineering energy usage and re-thinking chemical usage.