Improved Equivalent Circuit Model of BGA and RDL Combined Interconnection for 3D Packaging

In this paper, an improved equivalent circuit model is proposed to describe the 3D interconnection structure of BGA and RDL combined, which is the commonly used vertical interconnection in 3D stacked technology. In the frequency range from 0 to 40 GHz, the errors in S-parameters of the three test samples and models were 3.5%, 2.8% and 8.0%, respectively. The accurate equivalent circuit model of BGA and RDL combined structure is of great significance to 3D advanced packaging.