Co-Design and Implementation of a W-Band CMOS Transceiver With Packaging for 3-D stacked FMCW Radar Applications

This paper presents a co-design method and implementation of W-band transceiver. The chip integrates an octupler, a low-noise amplifier (LNA), a power amplifier (PA), and an IQ mixer, with all components thoughtfully designed to account for packaging considerations. The packaging is designed to completely eliminate electromagnetic interference and is optimized for the direct integration of an antenna on top of the chip. Fabricated in 65 nm CMOS technology, the transceiver works from 84-92 GHz. It achieves an output power of 12 dBm with a total power consumption of 450 mW. The chip features a compact core area of 1.8 mm × 2.4 mm.