Automated System of Substrates Positioning and Processing in Vacuum

The article presents the development of a vacuum system for depositing thin films with high thickness uniformity. Minimization of nonuniformity during ion processing and magnetron sputtering is achieved by controlled movement of the ion source and rotation of the substrate holder. Adjustment of the source-substrate distance without breaking the vacuum, as well as a 9-fold increase in the processing zone due to the movement of the ion source, provide a reduction in nonuniformity to 10%. Design documentation has been developed, automated models of units have been created and tested. Currently, software debugging and system integration are underway. Further work includes manufacturing and assembly of the system, as well as commissioning.