EMC Filter Drift Induced by Thermal Aging : Efficient Source Identification and Component Level Accelerated Aging Test

This paper presents the use of combined thermal step stress and fixed-temperature accelerated aging tests. VNA measurements are used to look for EMC level drifts. Step stress at EMC filter level reveals a deviation in common mode attenuation. A component is identified as the drift’s source and a fixed-temperature aging test is performed on it. Key points ensuring the validity of the results are discussed. Extraction of an aging law is considered. Perspectives and limits are presented.