Full-Wave 3D Modeling of Common-Mode Chokes up to 1GHz

Increasing near-field couplings due to miniaturization and increasing switching frequency due to new GaN and SiC transistor technologies pose new challenges in the EMC field. In this context, 3D FEM simulation is a valuable tool to prevent potential issues. This paper investigates 3D FEM simulation of CMCs by applying an accurate simulation methodology previously tested in single-winding inductors. The research is conducted in small-signal and room temperature conditions up to 1GHz, the highest frequency reached in the literature. To ensure the generality of the study, three cores of different materials were investigated (MnZn, NiZn and nanocrystalline). Their electromagnetic properties were extracted, and finally, how they influence the common and differential modes modeling of CMCs was studied.