PCB Design for Wireless Devices

Summary

This chapter provides a comprehensive overview of the design and development of printed circuit boards (PCBs) specifically tailored for wireless devices. It highlights the crucial role of PCBs in ensuring optimal performance and functionality in the field of wireless technology. This chapter covers key considerations and best practices in radio frequency (RF) PCB design, including layer stack‐up assignment, component placement, grounding methods, power plane design, and bypassing and decoupling strategies. Special focus is given to addressing the unique challenges posed by high‐frequency signals, signal integrity, power distribution, and interference mitigation. The significance of proper grounding, bypassing, and decoupling techniques is emphasized for maintaining signal integrity, reducing noise, and shielding RF circuits from external interference. This chapter also explores the design considerations for different circuit types, such as IF circuits, RF circuits, baseband circuits, and audio circuits, discussing strategies to minimize noise interference and optimize performance. Additionally, measures for reliable and efficient power supply operation in PCB design are presented. By equipping engineers and designers with the necessary knowledge and techniques, this chapter aims to facilitate the creation of high‐performance PCB layouts that meet the demanding requirements of modern wireless applications.