MEMS Thermal Actuator for Thermal Logic Gates Based on UV-LIGA Process

This paper presents a novel nickel-based thermal actuator fabricated using MEMS UV-LIGA technology, optimized through finite element simulation to construct thermally responsive AND/OR logic gates. This work achieves the realization of thermal logic gates by controlling the gap size of the output actuators to determine AND/OR relationships, with an input temperature sensitivity of $s0.2 \mu \mathrm{m}/\mathrm{K}$. Compared to conventional approaches, the proposed design offers a scalable and robust solution for implementing thermal computing systems, paving the way for robust, non-electric logic architectures suitable for harsh or power-constrained environments.