Thickness controllable 3D NAND flash package with wafer-level fan-out packaging

Three dimension multi-chip integration with high density can be realized by fan-out packaging technology. In this paper, we reported a multiple stacking fan-out package with controllable thickness for ultra-thin NAND flash chips. The minimum thickness can be compressed less than 672 um. If not include the BGA balls, the body thickness can be controlled about 265um. The thickness of the entire package can be continuously adjusted with the remaining Si carrier. We simulated three different NAND flash package structure, Package-on-Package, direct stacking without/without carrier, the result shows that the direct stacking structure have a better heat dissipation performance. This kind of ultra-thin package structure can be used for thickness sensitive and high heat dissipation requirement, such as the high performance mobile phones and Solid State Drives.