Design of an Implantable Antenna for Wireless Brain-Computer Interface

For the miniaturization, integration, and reliability requirements of implantable modules in wireless brain-computer interface (BCI) devices, this paper designs an implantable stacked patch antenna based on high-temperature co-fired ceramic (HTCC), utilizing coaxial-like through ceramic via (TGV) arrays feeding to achieve seamless integration of the antenna with the radio-frequency (RF) and digital hybrid circuit modules. This design avoids the impedance mismatch and signal loss typically introduced by soldering in conventional implantable systems, ensuring a more reliable sealing. Using full-wave electromagnetic simulation, the antenna's port characteristics and radiation characteristics are comprehensively analyzed. It can be seen that the designed antenna exhibits stable performance within the frequency range of 3.34~3.54 GHz, enabling operation at three usable frequencies (3.37 GHz, 3.44 GHz, and 3.51 GHz). Each of these frequencies meets the 60 MHz impedance bandwidth requirement.