Research on the Impact of Magnetron Sputtering Coating on Conformal Electromagnetic Shielding Performance

This study employs magnetron sputtering technology to deposit metal films (Cu, Ni) on plastic-encapsulated devices for preparing conformal electromagnetic shielding materials. Through optimization of sputtering parameters and structural design of the shielding layers, reliable bonding between the shielding material and the plastic substrate was achieved. The results indicate that sputtering power significantly influences the film deposition rate. As the sputtering power increases, the deposition rate accelerates, grain size enlarges, and shielding effectiveness initially improves but subsequently declines. By controlling deposition time, a Ni/Cu/Ni-structured shielding layer was fabricated, achieving a maximum shielding effectiveness of 50 dB at 18 GHz. After 500 thermal shock cycles (-55°C to 125°C), the shielding cavity structure remained intact, with no significant reduction in shielding effectiveness. The adhesion between the plastic substrate and shielding layer met design requirements.