Finite Element Simulation Study of Heat Sink Structure for Integrated Ceramic Substrates

With the increase of chip complexity, the design and production of substrates and chip tend to be "integrated", and ceramic substrates has been more and more widely used due to its advantages of good air tightness, multi-layer wiring, high insulation resistance, and close thermal expansion coefficient to the chip. In this paper, ANSYS finite element analysis software was used to simulate and analyze the stress of the integrated ceramic substrates under the conditions of temperature cycle and random vibration after being assembled on the PCB, and the results showed that the maximum stress of the lead wire was reduced by about 51% and 21% respectively compared with the whole block heat sink under the temperature cycle and random vibration conditions, so the block heat sink scheme was preferred.