Investigation on the reliability of TSV embedded micro pin-fin channel cooling in 3D integrated chip

Through-silicon via (TSV) technology enables 3D high-density integration, in which embedded microchannels offer reduced chip stacking and trigger severe thermal management challenges, yet the reliability of TSV embedded micro pin-fin channel cooling in 3D integrated chips is underrepresented. In our work, the distribution characteristics of the stress, strain and thermal expansion of the TSV under the effects of fluid - solid coupling and multi physics field coupling were calculated. The simulation results show that the maximum stress of the TSV is located at the junction of two substrates, which increases as the micro-channel extends along the flow direction. When the micro - channel is densified along the flow direction, the maximum stress of the TSV is reduced by 7.99 MPa. Contrast to the non-densified micro-channel, the denser mechanical performance is improved by 49.32%, which has been significantly enhanced to the TSV - integrated micro channel. Meanwhile, the maximum temperature of the denser microchannel is reduced by 23 K, and the MATD decreased by 50%, improving the temperature uniformity of system. Consequently, the overall thermal performance of the system is optimized effectively.