Impacts of Mini-Channel Geometry and Morphology on Two-Phase Cooling Performance for SiC Power Modules

Efficient thermal management of SiC power modules is essential for high power density and reliability in power electronics. This study introduces the Porous Pin-Fin Mini-Channel with Mesh Surface (PPMMS) cold plate, an advanced two-phase cooling solution that enhances heat dissipation, flow stability, and temperature uniformity. Experimental results show that PPMMS outperforms both Smooth Mini-Channels (SMCs) and Porous Mini-Channels (PMCs). Compared to SMC, the proposed PPMMS increased power dissipation by 61.42% at 25 ml/min and 62.02% at 50 ml/min coolant flow rate, while lowering average case temperature by 34.6°C and 27.4°C, respectively. Additionally, thermal resistance was reduced by 53.7% at 25 ml/min and 47% at 50 ml/min, confirming superior heat transfer efficiency. The porous pin-fin structure enables efficient water-vapor exchange, ensuring uniform power dissipation and temperature distribution, through effectively managing dry-out and boiling instabilities. Its capillary-driven liquid retention enhances cooling even at high power dissipation, and cuts coolant flow rate requirements by half compared to smooth mini-channels. By regulating two-phase flow, promoting evaporation, and improving rewetting, PPMMS offers a stable, efficient cooling solution. These findings establish PPMMS as a superior alternative to conventional mini-channels, enabling higher power densities and long-term reliability in next-generation SiC power modules.