Adhesive free packaging method for high stability fiber MEMS sensors based on laser fusion bonding

This paper presents an adhesive-free packaging method for fabricating fiber-optic MEMS sensors with high measurement stability using laser welding. After the aging process, the data measurement fluctuation of the sensor remains within 0.5 nm over a certain period, and the temperature cross-sensitivity is 0.2864 nm/°C, demonstrating excellent data measurement stability and reliability.