Various Types of Hybrid SOAs Using InP/SOI Chip-on-Wafer Bonding Technology Towards Large Scale Photonic Integrated Circuits

III-V/Si hybrid SOAs with different epitaxial structures are monolithically integrated on an SOI wafer, using chip-on-wafer direct bonding process. The control of gain characteristics through the design of the optical confinement to the active layer in the III-V/Si hybrid structure is demonstrated.