Innovative Driver ICs for Automotive LED Applications LED Backlight and Micro LED Display

High-brightness silicon-based micro-LED display technology and driver chips are driving Taiwan's semiconductor foundry industry to invest in the development of automotive 3D wafer processes using 12-inch wafers and 80nm nodes. Raffar Technology's 3D driver display chips, combined with high-brightness micro-LEDs, form a world-leading high-brightness micro-LED display module. This helps automotive display manufacturers adopt modular design and compete in the global automotive display market. The 12-inch 80nm process enables a 288-channel constant current static LED driver IC, with 300Mbps LVDS interface per channel. The high-brightness micro-LED chip uses 6-inch epi silicon wafers, with a chip size of 15x31μm and luminous intensities (Blue/Green/Red) of 0.8/4. 1/1 mcd @70μA. Micro-LED mass transfer features ±3 μm alignment accuracy, 99% transfer yield, and> 1 Omm x 10mm array per transfer; rework yield is 99.99% for the Micro LED Display.