Design and Simulation of Piezoelectric Acoustic Emission Sensor

Piezoelectric acoustic emission (AE) sensors, characterized by their simple structure, high sensitivity, and wide frequency bandwidth, demonstrate significant potential for applications in acoustic measurement, ultrasonic testing, and biomedical fields. In this study, epoxy resin doped with tungsten powder was adopted and used as the backing layer material, to enhance sensor sensitivity and reduce noise through material optimization. Based on the simulation model using COMSOL software, the influence mechanisms of the backing layer’s material composition and structural parameters on sensor performance were thoroughly investigated. Investigations revealed that both the mixing ratio of epoxy resin-tungsten powder and the backing layer thickness significantly influenced sensor sensitivity. Moreover, optimized backing layer designs effectively absorb and transmit AE signal energy while minimizing noise interference, thereby enhancing the overall sensor performance. Furthermore, the consistency between simulation results and experimental validation further demonstrated the effectiveness and accuracy of COMSOL-based simulation analysis in sensor design optimization.