How Cool is Diamond? for Heat Extraction and Integration

The continuous drive for higher power density in computing, RF electronics, and high-performance systems necessitates innovative thermal management strategies. While advances in chip packaging have improved heat dissipation, fundamental challenges remain due to obstructed heat pathways created by multiple material layers and low-conductivity dielectric stacks. Conventional cooling methods often fail to efficiently extract heat from within these complex architectures, limiting both device performance and longterm reliability.