Lifetime Prediction and Stability Analysis of TMR Chips Based on a Modified Arrhenius-Eyring Model

Tunnel magnetoresistance (TMR) chips must meet high reliability and long-term stability requirements in the field of precision measurement. This paper proposes an accelerated lifetime testing method based on multi-stress coupling. The method includes three stages: high temperature and high humidity (HTH), thermal cycling (TCT), and electrical overstress (EOL). By integrating failure physics models and statistical analysis, the lifetime distribution and degradation mechanisms of TMR chips are quantitatively evaluated. Experimental results demonstrate that the Arrhenius-Eyring model can accurately predict the designed lifetime (10 years at 25°C). Moreover, by applying dynamic noise spectrum analysis and a sensitivity drift correction algorithm, the long-term stability error is controlled within ±0.5%. This study provides a theoretical foundation for the reliability design and industrial application of TMR chips.