Finite Element Warpage Simulation and Optimization of Fan-Out Wafer-Level Packaging Based on Equivalent Modeling

This study systematically investigates the warpage control issue in 12-inch fan-out wafer-level packaging through the combined approach of finite element simulation and experimental validation. The real model of a reconstituted wafer containing 3,887 dies was developed to simulate the compression molding process, achieving simulation errors below 10% under six different die/epoxy molding compound thickness combinations. The research proposes a novel equivalent elastic modulus calculation method based on the self-consistent method and Eshelby tensor theory, which overcomes the limitations of traditional series-parallel models. This method effectively reduces computational complexity while maintaining simulation accuracy above 95%. The results demonstrate that the maximum error compared to real models does not exceed 5%, and the error remains within 10% when compared with the experimental data. The proposed equivalent method improves computational efficiency by approximately 33% through reducing contacts, node and element counts in the finite element model.