A Transfer Bonding Technology for Advanced 2.5-D Integration With Reduced Warpage and Improved Stacking Flexibility

A transfer bonding technology for advanced 2.5D integration with reduced warpage and improved stacking flexibility is presented. Molding-based and multi-RDL-layer based layer transfer are demonstrated for multiple stacking, both enabling high-density interposer integration without the need for CMP or complex lithography. Structural and electrical reliability is validated through optical inspection, SAT, SEM, and daisy-chain testing. Warpage measurements confirm a significant reduction across key process steps. The proposed transfer bonding technology provides a scalable and manufacturable solution for next-generation advanced packaging and heterogeneous integration.