Simulation Design of Low-Profile Equilateral Triangle Microstrip Patch Antenna

Background: An equilateral triangular microstrip patch antenna (ETMPA) suitable for 5G application technologies is being developed at a frequency of 28 GHz. Methods used: During the design phase, inset feed strategies are considered, antenna parameters are calculated, and their performance is evaluated using computer simulation technology (CST) and the High-Frequency Simulator system (HFSS). To achieve these objectives, several substrate materials of different heights and conductor patch material types are used, and their effects on the radiation performance of the antenna are investigated. Taconic-TLX-9 dielectric substrates made of copper and measuring h-0.2 mm in height bonding material are often used to create a dependable minimal low-profile (ETMPA) (4.59 mm3) with dependable radiation performance, according to simulation results. Results: Both methods have the S11, VSWR, efficiency, mobility, Gain, and bandwidth based on the standards above. Conclusion: Lastly, the suggested antenna design is one of the prerequisites for 5G technology and is smaller than most previous attempts.