Large-area Ag Sintering (40 mm × 51 mm) Application for Trans-fer Molded Power Module and Al Cooler

In this paper, we show the large-area Ag sintering technology for transfer molded power modules onto the heatsink. Here, a power module with an Ag plated backside was attached to an Ag coated Al plate with 5 mm thickness that simulates a heatsink. Even after 2,000 cycles of thermal shock test, no resin delamination was observed inside the module by selecting a resin with a glass transition temperature higher than the sintering temperature. Although 16.1% delamination was observed in the sintered layer between module and plate, it had little effect on thermal resistance. These results suggest that the Tg of a resin is an important parameter that determines the quality of power module.