Analysis and Improvement Techniques for Signal Integrity and Thermal Effect of High-Speed Pogo Pin Structures

With the advancement of modern technology, the manufacturing level and quality of spring pins used to connect test equipment and ICs under test are constantly improving and the range is wider. Among them, the design of the pogo pin can affect the accuracy and reliability of the testing process. For example, high contact resistance between pogo pins and ICs can cause voltage drops and signal distortion, improper pogo pin material selection can lead to premature failure, and design impacts on signal integrity. Since high-speed signals are highly sensitive to interference sources such as noise and crosstalk interference, signal integrity issues need to be considered when designing high-speed signals. Therefore, this paper mainly studies the test contact probes used in IC test equipment. Taking the IC test socket as an example, the design simulation and analysis were carried out on the impedance of the probe and the various effects of the socket design. Through the analysis of probe structure design, layout configuration, crosstalk effect, thermal effect, etc., subsequent simulation analysis of the module thermal effect is carried out, and improvement countermeasures are proposed. Vias of different diameters are introduced and their simulation results are observed.