LIME: Liquid Metal Packaging for Power Semiconductors

State-of-the-art power semiconductors use solid metal interconnects such as wire-bonding, soldering, and sintering. Thermo-mechanical stress degrades solid metal interconnects and is the main cause of failure in power semiconductors. This paper uses liquid metals, which are inherently resistant to thermo-mechanical stress, to replace solid metal interconnects. Preliminary results show that the use of liquid metals can increase the thermo-mechanical lifetime of power semiconductors by up to a factor of 40 to 60. Several iterations of liquid metal packages are shown, using both Silicon and Silicon Carbide chips.