DARPA HAPPI: New Dimensions in Photonics

The device and link density of today’s photonic integrated circuits lag microelectronics by many orders of magnitude. This limits the functionality of optical microsystems and the seamless cointegration of photonics with microelectronics. The DARPA Heterogenous Adaptively Produced Photonic Interfaces (HAPPI) program aims to break these limits and scale photonic circuits 100x by moving from planar to 3D photonic architectures.