Monolithically Integrated Microring Transmitter and Receiver for High-Density 3D Co-Packaged Optics

We report silicon microring transmitter and receiver with monolithically integrated driver and analog front end at up to 64Gbps NRZ. The total die area of the circuits is $0.006 \mathrm{~mm}^{2}$, $\gt 10 \mathrm{x}$ smaller than prior reports.