Scaling Co-Packaged Optical Interconnects Using Hybrid 2.5D/3D Integration

Tightly integrated optical interconnects can provide high-bandwidth, energy-efficient inter-node communication. We describe a novel system which uses hybrid 2.5D/3D integration to compose a state-of-the-art FPGA compute chiplet, three electrical interface chiplets, and three photonic interface chiplets. We use register-transfer-, gate-, transistor-, and device-level simulations to demonstrate the potential for this system to achieve 96Tb/s of bi-directional bandwidth, and we experimentally demonstrate key components including a complete opto-electrical channel. Our results provide a strong case for hybrid 2.5D/3D integration as the key enabler for scaling co-packaged optical interconnects.