Research on Workflow Optimization of SCARA Robot Based on Minimum Jerk Ripple-Free Algorithm

In high-speed operations of wafer spin-coating machines, the robotic arm responsible for wafer transport is prone to vibrations, leading to fluctuations in velocity and position. This ripple effect significantly impacts the uniformity of adhesive dispersion on the wafer, ultimately reducing product quality. This study employs a SCARA robotic arm to enhance operational precision and eliminate ripple effects. A three-dimensional model of the SCARA robot was constructed using SolidWorks, followed by dynamic simulations conducted in MATLAB. These simulations validated the effectiveness of a minimum-jerk, ripplefree, algorithm-based control strategy in reducing oscillations to improve dispensing accuracy. Finally, experimental validation was performed to assess the vibration optimization effect of the proposed algorithm on the SCARA robotic arm. The results demonstrate that the optimized robotic arm significantly mitigates ripple effects caused by vibrations, thereby improving the stability of the dispensing process at the end effector.