Embedded Vertical PDN (EV-PDN) Including Voltage Regulator (VR) for Over-1kW FC-BGA Based on Over-1mm Thick-Core Organic Substrate

A power delivery approach with embedded vertical power delivery network (EV-PDN) for reducing IR-drop in flipchip ball grid array (FC-BGA) based on extremely large size thick-core organic substrate will be presented for vertical power delivery with 1A/sqmm current density for the package supporting high performance over-1kW processors implemented by chiplet. By using EV-PDN, IR-drop in packagelevel power delivery can be significantly reduced.