Design Enablement Methodology for 3D Stacked RF Systems

We developed a novel design enablement approach for integrating chiplets with advanced package technology. This methodology empowers chiplet design teams to leverage advanced packaging technologies, enabling the optimization of RF chipletbased systems. Our approach achieves this by supporting codesign capabilities and ensuring interoperability with packaging Process Design Kits (PDKs) for 3D-stacked RF chiplet systems. Unlike traditional monolithic 2D design flows, the advanced 2.5D/3D packaging design flow encounters challenges in Electronic Design Automation (EDA) analysis. To enable seamless heterogeneous integration, it is crucial to establish hierarchical design schematics and layouts spanning both the chiplet and package domains in 2D and 3D. Additionally, simulation models are required to conduct design experiments on advanced package interconnecting structures effectively.